InPsytech Showcases 3nm UCIe 3.0 Technology
InPsytech, a subsidiary of Egis Technology, will participate in the Open Compute Project (OCP) Global Summit 2025 in San Jose, California.
The company will showcase its latest 3nm UCIe high-speed interface technology demo, featuring support for the newest UCIe 3.0 standard, 3D packaging integration, and ultra-high-speed, low-power performance.
This demonstration highlights InPsytech's advanced R&D capabilities in Chiplet interconnect technology and its role in supporting Egis Group's broader strategy in semiconductor design and heterogeneous integration.
Accelerating Innovation in Chiplet Ecosystem
Author's summary: InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025.